GR-30-W-AIO

Applications

Printed Circuit Boards
marking
engraving
structuring
Copper
marking
engraving
cutting
structuring
Plastics
marking
engraving
cutting
structuring
Glass/Crystal
marking
engraving
cutting
structuring
Silicon
cutting
structuring

Technical Specifications

General
Wavelength532 nm
Mechanical Dimensions Width 180 mm
Mechanical Dimensions Depth 337 mm
Mechanical Dimensions Height 114 mm
Net Weight13.2 kg
Laser
Beam Quality1.2 <M²
Maximum Pulse Energy375 µJ @ 80 kHz
Maximum Pulse Peak Power30 kW
Nominal Output Power pulsed30 W @ 80 kHz
Pulse Width2 - 18 ns
Adjustable Pulse WidthYes
Pulse Frequency40 - 300 kHz
Beam Diameter D4σ(only available with pre-installed beam expander 6x / 10x)0.7 mm
Laser Operation ModePulsed
Output TypeDirectbeam
Cooling / Temp.
Cooling MethodWater

532 nm | Water Cooled

Model NameWavelengthNominal Output Power pulsedBeam QualityMaximum Pulse EnergyMaximum Pulse Peak PowerPulse WidthPulse FrequencyNet WeightMechanical Dimensions Depth Mechanical Dimensions Height Mechanical Dimensions Width Cooling MethodInquiryDetail
GR-7-W-AIO532 nm7 W @ 50 kHz1.2 <M²140 µJ @ 50 kHz10 kW2 - 18 ns20 - 200 kHz8.7 kg302 mm114 mm180 mmWater
GR-10-W-AIO532 nm10 W @ 50 kHz1.2 <M²200 µJ @ 50 kHz15 kW2 - 18 ns20 - 200 kHz8.7 kg302 mm114 mm180 mmWater
GR-20-W-AIO532 nm20 W @ 80 kHz1.2 <M²250 µJ @ 80 kHz30 kW2 - 15 ns40 - 300 kHz8.8 kg302 mm114 mm180 mmWater
GR-30-W-AIO532 nm30 W @ 80 kHz1.2 <M²375 µJ @ 80 kHz30 kW2 - 18 ns40 - 300 kHz13.2 kg337 mm114 mm180 mmWater